Type(s) de contenu et mode(s) de consultation : Texte noté : électronique

Auteur(s) : Ohring, Milton (1936-....)  Voir les notices liées en tant qu'auteur

Titre(s) : Reliability and failure of electronic materials and devices [Texte électronique] / Milton Ohring

Publication : San Diego : Academic Press, cop. 1998

Description matérielle : 1 ressource dématérialisée

Note(s) : Includes bibliographical references and index
This book introduces the reader to the widely dispersed reliability literature of microelectronic and electro-optical devices. It integrates a treatment of chip and packaging level failures within the contexts of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying book thread concerns product defects - their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed ; The book can be used as an advanced undergraduate/graduate textbook for materials scientists and electrical engineers, and as a reference for reliability professionals

Autre(s) forme(s) du titre : 
- Autre forme du titre : Electronic materials and devices

Sujet(s) : Pannes  Voir les notices liées en tant que sujet
Appareils électroniques -- Fiabilité  Voir les notices liées en tant que sujet

Indice(s) Dewey :  621.381 (23e éd.) = Électronique (technologie)  Voir les notices liées en tant que sujet

Identifiants, prix et caractéristiques : ISBN 9780125249850

Identifiant de la notice  : ark:/12148/cb44637710m

Notice n° :  FRBNF44637710 (notice reprise d'un réservoir extérieur)

Table des matières : Ch. 1 ; An Overview of Electronic Devices and Their Reliability --Ch. 2 ; Electronic Devices: How They Operate and Are Fabricated --Ch. 3 ; Defects, Contaminants and Yield --Ch. 4 ; The Mathematics of Failure and Reliability --Ch. 5 ; Mass Transport-Induced Failure --Ch. 6 ; Electronic Charge-Induced Damage --Ch. 7 ; Environmental Damage to Electronic Products --Ch. 8 ; Packaging Materials, Processes, and Stresses --Ch. 9 ; Degradation of Contacts and Package Interconnections --Ch. 10 ; Degradation and Failure of Electro-optical Materials and Devices --Ch. 11 ; Characterization and Failure Analysis of Materials and Devices --Ch. 12 ; Future Directions and Reliability Issues.