Notice bibliographique

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Type(s) de contenu et mode(s) de consultation : Texte noté : électronique

Auteur(s) : Symposium on Naval Structural Mechanics (3 ; 1963 ; New York, N.Y)  Voir les notices liées en tant qu'auteur

Titre(s) : High temperature structures and materials [Texte électronique] : proceedings of the third Symposium on Naval Structural Mechanics held at Columbia University, New York, N.Y., January 23-25, 1963

Publication : New York : Symposium Publication Division : Pergamon Press, cop. 1964

Description matérielle : 1 online resource (480 pages)

Collection : Office of Naval Research Structural Mechanics Series


Note(s) : Includes bibliographical references at the end of each chapters and index. - Online resource; title from PDF title page (ebrary, viewed December 3, 2014).
High Temperature Structures and Materials is a compilation of the proceedings of the Third Symposium on Naval Structural Mechanics held at Columbia University in New York on January 23-25, 1963. The symposium provided a forum for discussing structural mechanics under conditions of elevated temperatures. Emphasis is placed on the various aspects of structural design for elevated temperature service. The following areas are covered: material aspects of elevated temperature design; effects of high-speed environment; thermal stress analysis; and design criteria and reliability. This book is compri


Sujet(s) : Matériaux -- Effets des hautes températures  Voir les notices liées en tant que sujet
Contraintes thermiques  Voir les notices liées en tant que sujet

Indice(s) Dewey :  620.112 17 (23e éd.) = Matériaux (ingénierie) - Résistance à des hautes températures  Voir les notices liées en tant que sujet


Identifiants, prix et caractéristiques : ISBN 9780080105802

Identifiant de la notice  : ark:/12148/cb44624808d

Notice n° :  FRBNF44624808 (notice reprise d'un réservoir extérieur)



Table des matières : Front Cover; High Temperature Structures and Materials; Copyright Page; Preface; Table of Contents; Welcoming Remarks; Opening of The Symposium; CHAPTER 1. TEMPERATURE DEPENDENCE OF ELASTIC AND ANELASTIC PROPERTIES IN SOLIDS; 1. INTRODUCTION; 2. PHONON-PHONON INTERACTIONS IN SEMICONDUCTORS AND INSULATING CRYSTALS; 3. EFFECT OF INTERSTITIALS DUE TO WATER VAPORON THE ATTENUATION AND VELOCITY OF ULTRASONIC WAVES, AND ON THE THERMAL RESISTANCE OF SODIUM CHLORIDE CRYSTLS.
4. use of elastic and anelastic measurements in determining the properties of electronic and hole energy surfaces-determination of the time constant of the piezoresistive effect5.dislocation mechanisms and their effects on elastic and anelastic properties; 6 . conclusions; references; discussion; chapter 2.thermo-mechanical behavior of ceramics; 1. introduction; 2 . crystal geometry; 3 . the plastic deformation of "rock-salt" type single crystals; 4 . polycrystalline specimens; 5. summary and conclusions; acknowledgements; references; chapter 3. physical aspects of creep; 1. introduction.
2. nabarro creep3. high temperature creep of pure metals; 4.qualitative description of a theory for creep of pure polycrystalline metals at high temperatures; 5.quantitative formulation of a theory for creep of pure polycrystalline metals at high temperature; 6. polyphase alloys; 7.averaging and spheroidization during high temperature creep; 8.effect of solute atoms on high temperature creep; 9. summary; references; chapter 4. creep rupture and the tertiary stage of creep; 1.introduction; 2.the stability of creep elongation; 3.deformation and fracture mechanisms; 4.summary and conclusions.
Conclusionreferences; chapter 7. materials aspects of the re-entry problem; 1.introduction; 2.thermal factor; 3.structural and design factors; 4.support structures; 5.heat shield materials; 6.sub-structure materials; 7. conclusion; acknowledgement; references; chapter 8. the analysis of problems of heat conduction and melting; 1.introduction; 2.thermomechanical coupling: temperature propagation; 3.general considerations: problems with prescribed boundary temperature; 4.general considerations: prescribed heat-input problems; 5.the approximate solution of heat conduction problems.

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