Notice bibliographique
- Notice
Type(s) de contenu et mode(s) de consultation : Texte noté : électronique
Auteur(s) : International Workshop on Nanopackaging (1re ; 2013 ; Grenoble, France)
Titre(s) : Nanopackaging [Texte électronique] : from nanomaterials to the atomic scale : Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27--28 June 2013 / Xavier Baillin, Christian Joachim, Gilles Poupon, editors
Publication : Cham : Springer, [2015]
Description matérielle : 1 ressource dématérialisée
Collection : Advances in atom and single molecule machines
Note(s) : Titre de l'écran-titre (visionné le 4 mars 2016). - Comprend des références bibliographiques
This book is a first attempt to merge two different communities: scientists and technologists.
Therefore, it is not a general overview covering all the fields of nanopackaging,
but is mainly focused on two topics. The first topic deals with atomic scale devices
or circuit requirements, as well as related recent technological developments; for
example, surface science engineering and atomic scale interconnects studies. The second
main part of the book brings CNT nano-materials solutions for resolving interconnect
or thermal management problems in microelectronics device packaging. This book is
not just useful for those who attended the International Workshop on Nanopackaging
in Grenoble, but can provide valuable information to scientists and technologists
in the nanopackaging community
Autre(s) auteur(s) : Baillin, Xavier. Fonction indéterminée
Joachim, Christian (1957-....). Fonction indéterminée
Poupon, Gilles. Fonction indéterminée
Indice(s) Dewey :
621.381 046 (23e éd.) = Électronique (technologie) - Conditionnement ; 541.2 (23e éd.) = Chimie théorique
Identifiants, prix et caractéristiques : ISBN 9783319211947
Identifiant de la notice : ark:/12148/cb44680262t
Notice n° :
FRBNF44680262
(notice reprise d'un réservoir extérieur)
Table des matières : Utilization of Peridynamic Theory for Modeling at the Nano-scale ; DNA Metallization
Processes and Nanoelectronics ; Evaluation of leakage current in 1-D silicon dangling-bond
wire due to dopants ; Direct Integration of Carbon Nanotubes in Si Microsystems ;
Nanopackaging requirements for atomic scale circuits and molecule-machines ; Single
crystal Au triangles as reconfigurable contacts for atomically smooth surfaces: Ultra
High Vacuum transfer printing ; Site-selective self-assembly of nano-objects on a
planar substrate based on surface chemical functionalization ; Silicon technologies
for nano-scale device packaging ; Designing Carbon Nanotubes Interconnects for Radio
Frequency Applications ; Packaging of bucky-balls/ bucky?tubes in transparent photo-active
inorganic polymers: New hope in the area of electronics and optoelectronics ; Novel
Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive
Components.