Notice bibliographique
- Notice
Type(s) de contenu et mode(s) de consultation : Texte noté : électronique
Auteur(s) : Licari, James J. (1930-....)
Titre(s) : Adhesives technology for electronic applications [Texte électronique] : materials, processes, reliability / by James J. Licari and Dale W. Swanson
Publication : Norwich, NY : William Andrew Pub., cop. 2005
Description matérielle : 1 online resource (xvi, 459 pages)
Collection : Materials and processes for electronic applications series
Note(s) : Includes bibliographical references and index
This book is unique in its comprehensive coverage of all aspects of adhesive technology
for microelectronic devices and packaging, from theory to bonding to test procedures.
In addition to general applications, such as dies, substrate, and lid and chip stack
attachments, the book includes new developments in anisotropic, electrically conductive,
and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture
(which comply with current environmental and energy requirements) are covered. Over
80 tables and 120 figures provide a wealth of data on properties, performance, and
reliability. Also included are examples of commercially available adhesives, suppliers,
and equipment. Each chapter provides comprehensive references
Autre(s) auteur(s) : Swanson, Dale W.. Fonction indéterminée
Sujet(s) : Électronique -- Matériaux
Adhésifs
Mise sous boîtier (électronique)
Indice(s) Dewey :
621.381 (23e éd.) = Électronique (technologie)
Identifiants, prix et caractéristiques : ISBN 9780815515135
Identifiant de la notice : ark:/12148/cb44651572k
Notice n° :
FRBNF44651572
(notice reprise d'un réservoir extérieur)
Table des matières : Introduction ; Functions and Theory of Adhesives ; Chemistry, Formulation, and Properties
of Adhesives ; Adhesive Bonding Properties ; Applications ; Reliability ; Test
and Inspection Methods ; Appendix ; Conversion Factors ; Abbreviations and Acronyms
; Index.
